LPCVD Coating machine

Application
It is suitable for semiconductor and photovoltaic fields. For TOPCon process cells in the photovoltaic field, LPCVD equipment can complete the preparation of tunnel oxide layer/poly layer in one stop. The combination of thermal oxygen and poly layer deposition can greatly increase production capacity, while compatible with i/d-Poly growth process.

Main Features

• Mature high-capacity process, dual-mode temperature control technology, film gauge protection technology;
• With a variety of coating technologies: multi-layer composite film, doped polysilicon technology;
• Patented rapid cooling furnace body: The latest patented technology makes the furnace body temperature drop to the required temperature quickly, and the cooling rate can be increased by more than 25%, which can improve the temperature uniformity in the furnace tube obviously;
• Fast adaptive pressure closed-loop control technology;
• MES/CCRM system with complete architecture and outstanding performance;
• Integrated industrial computer + Modular process control software;
• Comprehensive power failure safety treatment and abnormal protection of flange water.

Main Parameters

Item	Technical Parameter
Types of film formation	SiOX , i/d-Poly-Si
Loading size	Vertical loading method： 1400 pcs/ batch（182mm） , 1200片/ batch（210mm） Horizontal loading method： 2000 pcs/ batch（182mm） , 1800pcs/ batch（210mm）
Film thickness uniformity	SiOx uniformity: Adjustable thickness from 1-3nm, with 0.1nm precision, the thickness of SiOx is tested by polishing sheet; Poly uniformity: Adjustable thickness 50-200nm, with 0.1nm precision, the thickness of Poly thickness is tested by polishing sheet, within sheet: ≤4%,; between sheets≤4%; between batches ≤3% (>100nm)
UP -TIME	≥95%
Range of working temperature	400-750 °C
Temperature Control	6-point temperature control, internal and external dual-mode control
Heating method	Automatic slope heating and fast constant temperature function
Cooling method	The latest patented technology, 6 temperature zone section control active cooling furnace body
Accuracy and length of constant temperature zone	± 1℃ （550-700 ℃）
Warming-up time	RT 750 °C ≤ 45 min
Cooling rate	≥ 5℃ /min
Temperature control	Dual-mode precise control 1000mm/min continuously adjustable; Positioning accuracy ≤±1 mm;
The ultimate vacuum of the system	<3Pa
System air leak rate	The rate of pressure rise after the pump is stopped and the valve is closed＜ 2 Pa /min
Pressure control method	Quickly adjust fully automatic closed loop
Process control method	Process automatic control, multiple safety chain alarms
Human-computer interface	LCD display, touch operation, process editing, online monitoring, authority management, team management, networking function
MES	Equipped